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PM Modi Lays Foundation Stone of 3 Semiconductor Projects Worth ₹1.25 Lakh Crore

The foundation stone for three semiconductor projects worth approximately ₹1.25 lakh crore was laid via video conferencing by Prime Minister Narendra Modi on Wednesday. Additionally, on the occasion, the youth across the country were addressed by him.

The foundation stone was laid for three significant projects: the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facilities at Morigaon in Assam, and Sanand in Gujarat.

PM Modi Launch Semiconductor Projects

PM Modi Launches ₹1.25 Lakh Crore Semiconductor Projects

A post on X by Modi stated, "13th March 2024 - a special day in India's efforts to become a hub for semiconductors. Tomorrow, will take part in the 'India's Techade: Chips for Viksit Bharat' programme and lay the foundation stones for three semiconductor facilities worth over Rs. 1.25 lakh crore."

Modi added, "Among the highlights of the programme will be the participation of students from over 60,000 institutions. I would urge youngsters, and particularly those passionate about tech, to join tomorrow's programme."

The projects are aligned with the prime minister's vision to position India as a prominent global centre for semiconductor design, manufacturing, and technology development, thereby creating numerous employment opportunities for the country's youth, according to PMO.

The semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be established by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up semiconductor fabs in India. With an investment exceeding Rs. 91,000 crore, this will mark the inauguration of the country's first commercial semiconductor fab, as reported in Hindustan Times.

The Outsourced Semiconductor Assembly and Test facility in Morigaon will be developed by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of about ₹27,000 crore.

The OSAT facility in Sanand will be established by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of approximately ₹7,500 crore, as reported by Hindustan Times.

These initiatives will fortify the semiconductor ecosystem in India, providing a solid foundation for its growth. The facilities are expected to generate employment opportunities for thousands of youth within the semiconductor industry and stimulate job creation in allied sectors such as electronics and telecommunications.

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