HSMC lines German Infineon's technology for bln fab

New Delhi, Mar 28 (UNI) Hindustan Semiconductor Manufacturing Company (HSMC) today announced a technology agreement with Germany-based semiconductor major Infineon Technologies AG for setting up two semiconductor manufacturing facilities at over four-billion-dollar investment.

The first fab will require an investment of one billion dollars and will produce chips on 8-inch wafers. The second one, entailing 3.2-3.5 billion dollars investment, will manufacture 12-inch wafers.

HSMC has plans to set up 10 foudaries capacities.

''HSMC will start the project with two foundries and would later scale it up to ten foundries,'' HSMC Vice President (Communication) Vishal Verma said.

He added that the company is looking for partners for the rest of the founderies.

Phase one of the project will build nodes from 2009 onwards under a 200 mm foundry. The second phase will produce nodes under a 300 mm foundry by 2010.

The company's first products are expected within two years.

This is the first announcement after the notification of the semiconductor policy on March 22. The announcement of SemIndia's three billion dollars fab unit in Hyderabad, was made before the policy was unveiled.

''We have strategically selected Infineon. This will lead India to become a destination of choice for the future of manufacturing hi-tech products,'' HSMC Chairman Deven Verma told media persons here.

MORE UNI