SPEL signs MoU with California Micro Devices

Chennai, Jan 24 (UNI) SPEL Semiconductor Limited, India's first and only semiconductor IC Assembly and Test company, today signed an MoU with US-based California Micro Devices (CMD) to introduce two new package lines within Leadless Molded Package (LMP) family, launched in September 2006.

SPEL Chief Executive Officer (CEO) Sam Varghese and CMD President and CEO Robert C Dickinson signed the agreement in the presence of SPEL Vice Chairman Rm Arun, Tamil Nadu Industries Secretary Shaktikantha Das and IT Secretary C Chandramouli here.

The two new micro thin package lines to be unveiled are Thin Leadless Molded Package (TLMP) and Ultra Thin Leadless Molded Package (UTLMP).

Speaking on the occasion, Mr Arun said SPEL initiated its US Dollar 286 million five-year growth plan with the inauguration of LMP line last year.

As the current capacity of 252 million units per annum had been completely sold out to SPEL's existing customers, the company was now further expanding within its existing facility to meet the increased demand for additional capacity, he said.

The expansion would be at a total cost of USD 7.75 million including equipment investment of USD 2.2 million.

The equipment would be in place by April and the line qualification for TLMP would be completed by June and for ULTMP by August, he added.

Mr Verghese said the demand for products in small profile, leadless packages had increased dramatically with growing popularity of thin profile mobile handsets and other small portable devices such as portable media players, MP3 players and digital cameras and camcorders.

UNI