VIA Technologies launches new digital media IGP chipset

New Delhi, Oct 1 (UNI) VIA Technologies, leading innovator and developer of silicon chip technologies and PC platform solutions, has introduced its new VIA CX700M digital media IGP chipset for the VIA C7 and Eden processor platforms.

Designed specifically for the embedded market, the VIA CX700M integrates graphics, audio, memory, storage, and HDTV support in a single chip design. This unified design enables the creation of smaller form factor designs, reduced power consumption, and easier cooling for an expanded range of embedded solutions.

''Building on the success of earlier single chip solutions for the embedded market, the VIA CX700M clearly demonstrates VIA's leadership in integration of the latest features such as HDTV support into smaller and smaller designs,'' VIA Technologies Special Assistant to the President (Processor Platform Product Marketing) Chinhwaun Wu said.

''As demand increases for embedded devices in the living room, or in applications such as high definition point of sale displays, the VIA CX700M provides an ideal platform to propel a new wave of solutions ready for the latest high definition content and displays, he added.

Measuring 35mm x 35mm, the chipset generates a silicon real estate saving of over 42 per cent. It comes with a range of features like built in HDTV encoder for connection to the latest displays, multi-configuration LVDS/DVI transmitter, enhanced video quality, powerful image enhancement technology, memory controller technology and integrated VIA Vinyl HD Audio controller.

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