VIA unveils VX700 chipset solution

New Delhi, July 7 (UNI) Chip maker VIA Technologies today announced the launch of a single chipset solution for the VIA Ultra Mobile platform, to help reduce the small size mobile form factor devices by 40 per cent.

The new 35mm x 35mm VIA VX700 chipset enables smaller form factor computing devices with reduced power consumption and enhanced functionality.

''The VIA VX700 sets a new industry milestone for functionality and performance in a single chipset package,"'' said VIA Special Assistant to the President (Processor Platform Product Marketing) Chinhwaun Wu.

Headquartered in Taiwan, VIA Technologies is the supplier of logic chipsets, low power processors, multimedia, networking and storage silicon.

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