• search

VIA unveils VX700 chipset solution

Written by: Staff
|

New Delhi, July 7 (UNI) Chip maker VIA Technologies today announced the launch of a single chipset solution for the VIA Ultra Mobile platform, to help reduce the small size mobile form factor devices by 40 per cent.

The new 35mm x 35mm VIA VX700 chipset enables smaller form factor computing devices with reduced power consumption and enhanced functionality.

''The VIA VX700 sets a new industry milestone for functionality and performance in a single chipset package,"'' said VIA Special Assistant to the President (Processor Platform Product Marketing) Chinhwaun Wu.

Headquartered in Taiwan, VIA Technologies is the supplier of logic chipsets, low power processors, multimedia, networking and storage silicon.

UNI CS PV VC1430

For Daily Alerts

For Breaking News from Oneindia
Get instant news updates throughout the day.

Notification Settings X
Time Settings
Done
Clear Notification X
Do you want to clear all the notifications from your inbox?
Settings X
X
We use cookies to ensure that we give you the best experience on our website. This includes cookies from third party social media websites and ad networks. Such third party cookies may track your use on Oneindia sites for better rendering. Our partners use cookies to ensure we show you advertising that is relevant to you. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on Oneindia website. However, you can change your cookie settings at any time. Learn more