Cadence launces EDA products enabling SIP(IC) design

New Delhi, June 26 (UNI) Cadence Design Systems Inc, makers in global electronic-design innovation, today launched the industry's first complete set of EDA products and capabilities, enabling the mainstreaming of System-In-Package (SIP) IC design.

''We selected Cadence for Radio Frequency (RF) SIP modules because they had the technology, capability and commitment to work with us to define a solution that can be broadly adopted across freescale, enabling us to bring our RF SIP methodology to the next level,'' Freescale Semiconductor Inc RF Methodology Manager Nigel Foley said.

According to the Semico Research Corporation, the revenue for SIP contract manufacturers will reach 747.9 million dollars by 2007.

SIPS are used extensively in wireless, networking and consumer-electronics applications such as cell phones, bluetooth modules, WLAN modules and network packet switching.

New products include the Cadence RF SIP methodology kit, two new RF SIP products, Cadence SIP RF architect and Cadence SIP RF layout, and three new digital SIP products -- SIP digital architect, SIP digital SI, and SIP digital layout.

The goal of the Cadence kits approach is to enable our customers to accelerate the segment-specific product development.

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