VIA with APEC Digital Opportunity Center to enter ICT Alliance

New Delhi, May 7 (UNI) Taipei-based VIA Technologies Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, entered into a strategic ICT Alliance with the APEC Digital Opportunity Center (ADOC) to help bridge the digital divide in the emerging markets.

With the guiding principle of enabling people to harness the full potential of Information and Communications Technology (ICT), ADOC objectives are fully in line with those of the VIA pc-1 Initiative founded last year.

''VIA and ADOC share the fundamental goal of empowering people and countries through technology, providing a powerful commitment to make a real difference to people's lives,'' VIA Technologies Vice President (Marketing) Richard Brown said.

He added that this alliance underlines the importance the company places on working with government agencies to facilitate broader ICT adoption that truly meet the needs of emerging markets around the world.

''The ICT Alliance is a practical, sustainable approach to bridging the digital divide while also stimulating local technology growth, a solid cooperation platform for creating win-win situations,'' APEC Digital Opportunity Center Secretariat Li-Chung Shao said.

VIA is the first vendor in Taiwan to enter into partnership with ADOC in the ICT Alliance, and has been working on the first project under the ADOC umbrella -- the establishment of an ICT center at a university in northern Vietnam -- which is scheduled to open later this month.

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