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VIA to meet global demand of Ultra Mobile Personal Computers

Written by: Staff

New Delhi, May 2 (UNI) VIA Technologies, a leading innovator and developer of silicon chip technologies and PC platform solutions, has initiated major steps to meet the growing global demand of Ultra Mobile PC devices based on 'Origami' platform developed by Microsoft that combines the functionality of PDA and a PC with advanced connectivity features.

VIA first demonstrated the new generation UMPC devices powered by the VIA C7-M ULV professor at CeBIT, Hannover, last month, including the ''SmartCaddie'' from Japan-based PBJ, which has already launched this product in the Japanese market.

''As consumers lead increasingly mobile lifestyles, they are demanding a new generation of lightweight ultra compact devices that will not only give them easier access to digital content such as music and movies, but will also allow them to carry out a full range of computing tasks,'' Mr Richard Brown, Vice President of Corporate Marketing, VIA Technologies, told mediapersons here today.

He further said that with the new VIA C7-M ULV (Ultra Low Voltage) processor platform, VIA is taking major steps to provide the right solution for enabling the developing of these innovative devices, combining the best performance per watt operation in the industry with the smallest silicon footprint in the market.

The Company is also seeing growing demand for VIA C7-M ULV processor based UMPCs in all other major global market, and expects to see such products launched by partners in India in the second half of 2006, Mr Brown said and added that ''in addition to meeting the needs of ultra mobile consumers, VIA products are also ideal for a wide range of vertical applications such as healthcare and education.'' Through VIA's new Technology Innovation Center launched in Mumbai in January 2006, ''We are working on a number of exciting projects on the PHD (power, heat and dust) in the areas of wireless mesh networking and kosk computing,'' he said.

The establishment of Technology innovation Centre has given VIA the perform platform for nurturing win-win partnerships to develop innovative new solutions for emerging markets, Mr Brown said.

As part of its VIA pc-1 initiative, VIA has played a major role in bringing down the price of Personal Computers in India and around the world. It has set up Affordable Computing Laboratories in various IITs including those in Mumbai and Bangalore, and was first to enable PCs priced below Rs 10,000 and laptops below Rs 30,000, in close association with its OEM partners in India.

VIA has by far th largest share of the Indian thin client (low cost, centrally-managed computers) market and has helped banks, insurance and other financial and educational institutes reduce costs on basic IT infrastructure, Mr Brown said.

Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system integrators.


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