Washington, July 23 (ANI): An advanced cooling technology being developed for high-power electronics in military and automotive systems can handle nearly 10 times the heat generated by conventional computer chips, researchers have demonstrated.
The miniature, lightweight device uses tiny copper spheres and carbon nanotubes to passively wick a coolant toward hot electronics, according to Suresh V. Garimella, the R. Eugene and Susie E. Goodson Distinguished Professor of Mechanical Engineering at Purdue University.
This wicking technology represents the heart of a new ultrathin "thermal ground plane," a flat, hollow plate containing water.
Similar "heat pipes" have been in use for more than two decades and are found in laptop computers. However, they are limited to cooling about 50 watts per square centimeter, which is good enough for standard computer chips but not for "power electronics" in military weapons systems and hybrid and electric vehicles, Garimella said.
The research team from Purdue, Thermacore Inc. and Georgia Tech Research Institute is led by Raytheon Co., creating the compact cooling technology in work funded by the Defense Advanced Research Projects Agency, or DARPA.
The team is working to create heat pipes about one-fifth the thickness of commercial heat pipes and covering a larger area than the conventional devices, allowing them to provide far greater heat dissipation.
New findings indicate the wicking system that makes the technology possible absorbs more than 550 watts per square centimeter, or about 10 times the heat generated by conventional chips. This is more than enough cooling capacity for the power-electronics applications, Garimella said.
The findings are detailed in a research paper appearing online this month in the International Journal of Heat and Mass Transfer and will be published in the journal's September issue. The paper was written by mechanical engineering doctoral student Justin Weibel, Garimella and Mark North, an engineer with Thermacore, a producer of commercial heat pipes located in Lancaster, Pa.
"We know the wicking part of the system is working well, so we now need to make sure the rest of the system works," North said.
The new type of cooling system can be used to prevent overheating of devices called insulated gate bipolar transistors, high-power switching transistors used in hybrid and electric vehicles. The chips are required to drive electric motors, switching large amounts of power from the battery pack to electrical coils needed to accelerate a vehicle from zero to 60 mph in 10 seconds or less.
Potential military applications include advanced systems such as radar, lasers and electronics in aircraft and vehicles. (ANI)