Freescale, IBM team up for tech development
Bangalore, Jan 25: Freescale Semiconductor and IBM today announced that Freescale will join the IBM technology alliance for joint semiconductor research and development.
The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.
This agreement brings together Freescale's leadership in key embedded markets, including automotive, networking, wireless, industrial and consumer, with IBM's success in developing world-class technology and industry-leading systems expertise.
This alliance will enable Freescale to further strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners. The Common Platform provides its semiconductor fabrication partners with synchronized manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.
"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale. "This industry-leading technology roadmap will enable Freescale to deliver substantial value to our customers."
"Freescale's
addition
to
the
IBM
technology
alliance
is
a
significant
vote
of
confidence
for
IBM's
collaborative
model
and
the
work
we
are
doing
jointly
with
our
technology
partners,"
said
Lisa
Su,
vice
president,
Semiconductor
Research
and
Development,
IBM.
"Freescale
will
be
a
valuable
addition
to
our
team,
with
its
deep
expertise
in
semiconductor
process
development
and
fast
growing
embedded
applications,
like
automotive,
networking
and
wireless.